Job description
Join Micron Semiconductors as a Member of Technical Staff in Process Development, focusing on Dry Etch for NAND devices. This role leads critical dry etch modules and contributes to NAND scaling strategies across advanced process nodes. You will combine deep etch expertise, data driven problem solving, and mentorship to enable high yield production and ongoing technical leadership.
In this role you will own and optimize dry etch process modules, partner with cross functional teams to drive yield, reliability, and throughput improvements, and push the boundaries of materials and process technology. You will plan and execute development programs, validate process changes on pilot lines, and ensure robust transfer to manufacturing.
We welcome engineers who thrive in a fast paced, highly collaborative environment where experimentation, data analytics, and rigorous documentation are essential. The ideal candidate will bring hands on etch experience, a systems mindset, and strong communication skills to influence multiple teams from process integration to device engineering.
At Micron, you will have the opportunity to work with leading edge equipment and materials, mentor junior engineers, and contribute to NAND scaling initiatives that drive memory performance, yield, and manufacturability. This is a hands on, impact driven role with clear pathways for growth and technical leadership.
Responsibility
- Lead the development and optimization of dry etch processes for NAND devices, including recipe creation, process tuning, and tool performance optimization.
- Own process qualification and transfer from R&D to high volume manufacturing, ensuring robust functionality across tool platforms.
- Design and execute DOE based experiments to improve etch uniformity, selectivity, and critical dimension control.
- Collaborate cross functionally with process integration, device engineering, and reliability teams to drive yield and reliability improvements.
- Troubleshoot etch related process variations and implement containment and corrective actions on the line.
- Document procedures, generate process notes, and maintain comprehensive process control plans and manuals.
- Mentor and train junior engineers and technicians, sharing best practices and technical guidance on dry etch strategies.
- Coordinate with equipment vendors for tool maintenance, upgrades, and calibration to sustain process stability.
Qualification
- MS or PhD in Electrical Engineering, Chemical Engineering, Materials Science, or a related field, or equivalent industry experience.
- 5+ years of hands on dry etch process development in semiconductor manufacturing, with NAND or flash memory experience preferred.
- Deep knowledge of plasma etching, RIE, ICP, etch chemistries, and reactor tuning for optimized throughput and CD control.
- Strong experience with design of experiments, statistical analysis, SPC, and data-driven decision making.
- Proven problem solving and root cause analysis capabilities in complex manufacturing environments.
- Ability to lead projects and mentor junior teammates, with excellent collaboration and communication skills.
- Experience with process documentation, risk assessment, and factory floor documentation standards.
- Familiarity with cleanroom operations, safety standards, and vendor management.