Job description
Micron Semiconductors is seeking a Principal Engineer to lead Process Development for Dry Etch in NAND fabrication in Singapore. This senior role drives breakthrough etch processes, collaborating with cross-functional teams to deliver high-performance memory devices. You will own the development roadmap for dry etch chemistry and plasma processes, guide multi-discipline engineers, and manage equipment qualification and process transfer to manufacturing. The ideal candidate will combine deep technical knowledge with leadership experience to accelerate process maturity from lab to production, optimize etch selectivity, profile control, and uniformity, and ensure robust yield and reliability. You will work with design, materials, reliability, and manufacturing engineering to translate device requirements into scalable etch solutions, while maintaining safety, quality, and cleanroom discipline. The role offers strong growth, competitive compensation, and the opportunity to influence NAND technology at one of the leading memory suppliers.
Responsibility
- Lead process development efforts for dry etch in NAND fabrication, including experimental planning, execution, and technology maturation.
- Design and run DOE experiments to optimize etch chemistries, profile control, selectivity, and etch rate, then analyze data to drive decisions.
- Characterize etch performance using metrology tools (SEM, profilometry, AFM) and implement process improvements to tighten uniformity and critical dimensions.
- Collaborate with equipment vendors and fab teams to qualify plasma etch tools and integrate new process steps into manufacturing.
- Develop robust process windows, recipe parameters, and transfer plans to manufacturing; create clear work instructions and acceptance criteria.
- Partner with design, materials, reliability, and manufacturing engineering to translate device requirements into scalable etch solutions and manage risk.
- Drive yield and defect reduction through root cause analysis, RCA, and SPC, ensuring sustained device performance and reliability.
Qualification
- Advanced degree in electrical engineering, chemical engineering, materials science, or related field; 10+ years of semiconductor process development experience with dry etch.
- Deep hands-on expertise in plasma etching and dry etch chemistries used for NAND memory devices; strong problem-solving and data analysis skills.
- Proven track record leading NAND flash or memory device process development and successful technology transfer to manufacturing.
- Strong experience with DOE, statistical analysis, SPC, and data-driven decision-making; proficiency with JMP, Minitab, or similar tools.
- Proficient in metrology and characterization tools such as SEM, TEM, AFM, profilometry, and optical metrology; ability to interpret results to drive process improvements.
- Excellent communication and leadership skills; ability to influence cross-functional teams and present findings to executives.
- Knowledge of cleanroom operations, safety, and equipment reliability; strong project management and collaboration skills.
- Willingness to work in Singapore and participate in a fast-paced, growth-oriented environment.