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Staff Engineer – Process Development, Photolithography, NAND

Micron Semiconductors
Singapore
Salary Estimate
SGD 180.000 – SGD 260.000
Posting Time
6 Mei 2026
Deadline
6 Mei 2027

Job description

Join Micron Semiconductors as a Staff Engineer focused on Process Development in Photolithography for NAND flash memory. In this pivotal role based in Singapore, you will lead cutting-edge lithography programs that advance performance, yield, and cost targets for next-generation NAND devices. You will collaborate with cross-functional teams to translate research into scalable manufacturing processes, optimize exposure strategies, resist chemistries, and metrology methods, and ensure robust process control from development through high-volume production.

As a technical leader, you will own optimization roadmaps, define experiments, analyze complex data, and implement solutions that reduce defects and variability. You will mentor engineers, partner with equipment vendors, and champion safety, quality, and compliance in a state-of-the-art cleanroom environment. This is a rare opportunity to influence the technology trajectory of NAND memory at a global leader in semiconductors.

Responsibility

  • Lead and manage advanced photolithography development programs for NAND devices, from concept to high-volume manufacturing.
  • Define and execute DOE plans to optimize lithography performance, yield, and process stability.
  • Collaborate with Materials, Equipment, Process Integration, and Yield teams to scale new processes into production.
  • Troubleshoot complex lithography issues, perform root-cause analysis, and implement robust corrective actions.
  • Develop and maintain process recipes, process controls, and documentation to meet quality and safety standards.
  • Mentor and develop junior engineers, building capability in lithography technologies and lab practices.
  • Interface with tool vendors for qualification, maintenance, and technology upgrades; manage risk and project timelines.
  • Translate research findings into scalable processes, driving improvements in defectivity, overlay, and throughput.

Qualification

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related field; 8+ years of semiconductor process development experience.
  • Extensive hands-on experience with photolithography processes for NAND or similar memory devices, including resist chemistry, exposure, bake, and post-exposure processes.
  • Strong expertise in DOE, statistical analysis, and data-driven decision making (Python, R, MATLAB, JMP, or equivalent).
  • Experience with process control (SPC), yield improvement, and root-cause analysis methods (RCA, 5 Whys, Ishikawa).
  • Familiarity with metrology tools (SEM, profilometry, critical dimension measurement) and defect analysis techniques.
  • Excellent collaboration and communication skills; demonstrated ability to lead cross-functional teams in a fast-paced environment.
  • Experience in cleanroom operations, EHS compliance, and documentation practices for GMP/quality environments.
  • Proven track record of translating development work into scalable, high-volume manufacturing success.

Required Skills

photolithography NAND semiconductor process development DOE SPC data analysis Python MATLAB R JMP cleanroom lithography materials resist chemistry overlay defectivity process integration

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